====== Decapsulating IC Packages with a Laser ======

Status: Planned ([[https://git.fa-fo.de/fafo/techtree/issues/7| Tech Tree]])


===== Commercial Decapsulation Systems =====

Commercially available laser-based decapsulation systems all seem to use fibre lasers with a wavelength of 1064 nm and power of around 20 W to 30 W. They all provide the ability to control both the pulse width as well as the pulse repetition frequency. The systems listed below all list the following potential applications:
  * Semiconductor failure analysis
  * IC decapsulation and removing large filler mold compounds, such as resin and plastics
  * Expose Wire Bonds


|                            ^ Baublys BL5500 ((https://www.baublys.de/en/product/fiber-laser-decapsulation-system-bl5500-series))     ^ Nisene LaserEtch LE-1064 ((https://www.nisene.com/products/laseretch-le-1064/)) ^ Sesame Plasma ((https://digit-concept.com/equipments/sesame-laser/)) |
^ Type                       | Ytterbium fibre laser | Fibre laser              | Fibre Laser        |
^ Wavelength                 | 1064 nm               | 1064 nm                  | IR                 |
^ Power                      | 20 W                  | 30 W                     | 20 W               |
^ Pulse Width                | 4 ns - 200 ns         | 4 ns - 200 ns            | ?                  |
^ Pulse Repetition Frequency | 1.6 kHz - 1000 kHz    | 1 kHz - 4000 kHz         | ?                  |

===== Cheap Laser Engravers =====

|                             ^ ComMarker B6 MOPA    ^ omtech JPT MOPA  ^
^ Price                        | $2,459 (14.11.2026) | €4,199.99        |  
^ Z-Axis                       | Motorized           | Motorized        |
^ Working Surface              | 150 mm x 150 mm     | 150 x 150 mm     |
^ Controller Board             | BJJCZ LMCV4         | ?                |
^ Laser                        | JPT MOPA            | JPT MOPA         |
^ Type                         | Fibre               | Fibre            |
^ Nominal Average Output Power | 60 W                | 60 W             |  
^ Central Emission Wavelength  | 1064 nm             | 1064 nm          |
^ Pulse Width                  | 2 ns - 500 ns       | 2 ns - 500 ns    |
^ Pulse Repetition Frequency   | 1 kHz - 4000 kHz    | 1 kHz - 4000 kHz |
^ Maximum Pulse Energy         | 2 mJ                |


===== Prior Art =====

On the [[https://siliconpr0n.org|Siliconpr0n]] wiki, there is a [[https://siliconpr0n.org/wiki/doku.php?id=decap:laser|page]] that losely documents previous experiments with fibre, CO2, and blue light (~ 450 nm). The TLDR:
  * **Fibre**: bulk material for standard packages (PDIP, COB, etc.). Laser apparently damages the die surface, if all packaging material is removed.
  * **CO2**: Mixed results, with fused glass spheres becoming a problem. Seems to work for COB.
  * **Blue Light**: can work for all package types but apparently slow.

===== Further Resources =====

  * [[https://www.slideshare.net/slideshow/effective-laser-decapsulation-employing-the-digital-ico-laser-and-hazmethodology/69262102|Effective Laser Decapsulation Employing the Digital ICO Laser and HAZ-Methodology]]  (//look into /documents in the NAS for a PDF copy//)
  * [[https://em-smart.com/blogs/laser-basics/laser-engraving-power-speed-frequency-fiber-laser-settings|Laser Engraving Power, Speed & Frequency Explained]] A very basic guide into laser engraving featuring MOPA fibre lasers.
  * [[https://www.rp-photonics.com/q_switched_lasers.html|Q-switched Lasers]]