Table of Contents

Decapsulating IC Packages with a Laser

Status: Planned ( Tech Tree)

Commercial Decapsulation Systems

Commercially available laser-based decapsulation systems all seem to use fibre lasers with a wavelength of 1064 nm and power of around 20 W to 30 W. They all provide the ability to control both the pulse width as well as the pulse repetition frequency. The systems listed below all list the following potential applications:

Baublys BL5500 1) Nisene LaserEtch LE-1064 2) Sesame Plasma 3)
Type Ytterbium fibre laser Fibre laser Fibre Laser
Wavelength 1064 nm 1064 nm IR
Power 20 W 30 W 20 W
Pulse Width 4 ns - 200 ns 4 ns - 200 ns ?
Pulse Repetition Frequency 1.6 kHz - 1000 kHz 1 kHz - 4000 kHz ?

Cheap Laser Engravers

ComMarker B6 MOPA omtech JPT MOPA
Price $2,459 (14.11.2026) €4,199.99
Z-Axis Motorized Motorized
Working Surface 150 mm x 150 mm 150 x 150 mm
Controller Board BJJCZ LMCV4 ?
Laser JPT MOPA JPT MOPA
Type Fibre Fibre
Nominal Average Output Power 60 W 60 W
Central Emission Wavelength 1064 nm 1064 nm
Pulse Width 2 ns - 500 ns 2 ns - 500 ns
Pulse Repetition Frequency 1 kHz - 4000 kHz 1 kHz - 4000 kHz
Maximum Pulse Energy 2 mJ

Prior Art

On the Siliconpr0n wiki, there is a page that losely documents previous experiments with fibre, CO2, and blue light (~ 450 nm). The TLDR:

Further Resources

1)
https://www.baublys.de/en/product/fiber-laser-decapsulation-system-bl5500-series
2)
https://www.nisene.com/products/laseretch-le-1064/
3)
https://digit-concept.com/equipments/sesame-laser/