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equipment:edwards-306:log [2026/04/19 11:55] – q3kequipment:edwards-306:log [2026/05/16 22:22] (current) – [Day 2026-05-6 (q3k, implr, hugo)] q3k
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 ===== Journal for the Edwards AUTO 306 Coating Systems ===== ===== Journal for the Edwards AUTO 306 Coating Systems =====
 +This is the journal.  See the [[equipment:edwards-306:start|Edwards AUTO 306 Coating System]] project page for an overview.
  
-==== Day 2026-03-30 ==== +==== Day 2026-05-16 (q3k, implr, hugo) ==== 
-Brought the two coating systems and the control cabinet into our lab.+ 
 +Further work on the e-beam. Successfully evaporated Al (~140nm, multiple runs) on Cr (~1nm) on glass. Good adhesion. 
 + 
 +Al is very slow to evaporate for some reason. 
 + 
 +Successfully evaporated Al on Si. 
 + 
 +Successfully evaporated SiO2 on Al on Si. 
 + 
 +The cooling capacity from the chiller is a bit on the low side, especially when evaporating Al. It seems beneficial to go 'fast and hard' and let the system accumulate heat just for a short period of time rather than slowly depositing very little material but causing the temperature of the cooling water to increase past 35 degrees. 
 + 
 +==== Day 2026-05-15 (q3k, implr, leah, rahix) ==== 
 + 
 +Rewired the thermal evaporator for 3 phase supply and installed infrastructure for it.  It runs from a 16A circuit now, and has a separate 4mm² potential bonding connection. 
 + 
 +A separate socket on the same 16A circuit will follow for the sputter coater. This means you shouldn't run them both at the same time. 
 + 
 +E beam supply has been tested and working. We had to manually enable the water flow sensor interlock input on the control cabinet (purple jumper wire). 
 + 
 +Getting the e-beam to run was annoying - turns out the system needs to be in 'process' mode. 
 + 
 +==== Day 2026-05-14 (implr, q3k, Hugo) ==== 
 + 
 +First attempt at starting the sputter system. Hotwired just the Edwards supply skipping Wedel's interlock and pumped down. 3.4E-5 mbar ultimate pressure. 
 +Examined the plasma high voltage box - in current configuration it looks like it's just a rectifier + series resistance. 
 + 
 +{{:equipment:edwards-306:e306_plasma_hv_box.jpg?600|}} 
 + 
 +Added a manual vent valve to one of the flanges on the back. Replaced the blocked up sintered KF ring on the vent path with a plain ring. 
 +Plasma works, with some arcing around the electrodes - possibly breakdown of the built up film? 
 +==== Day 2026-05-07 (q3k, Rob) ==== 
 + 
 +Plasma experiments. Chamber is really filthy and nonconductive, that might be an issue in building a nice plasma across the whole chamber. 
 + 
 +Roughly cleaning the chamber with scotchbrite, blue towels, kimwipes soakes in isoprop as a proof of concept to see if surface becomes conductive and a better plasma can form. 
 + 
 +==== Day 2026-04-25 (q3k, rahix, zdmx, leah, rob, guest) ==== 
 +Played with some coating tests, see [[projects:semiconductors:log#day_2026-04-25_q3k_rahix_zdmx_leah_rob_guest|Lab Notes for FAFO Semiconductor Processes (2026-04-25)]]. 
 +==== Day 2026-04-19 (q3k, Hugo, Guest) ==== 
 + 
 +Vent valve was not stuck - a sintered KF filter ring in front of it was. Removed filter ring, replaced with normal ring. Chamber now vents aggressively, added a flow restrictor outside that also acts as a very coarse filter. 
 + 
 +Film thickness monitor worked for a while, but now seemingly detects a broken crystal. Need to read more into the manual. 
 + 
 +Successfully coated Al on glass. Glass slide was held with Aluminium foil. Need better substrate holder for small/experimental pieces - to be designed.
  
 ==== Day 2026-04-18 (q3k, Hugo, Rob, Jana, ln, Guest x3) ==== ==== Day 2026-04-18 (q3k, Hugo, Rob, Jana, ln, Guest x3) ====
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 Needle valve operates. Butterfly valve in front of needle valve seems to leek - needle valve must be closed on each use. Needle valve operates. Butterfly valve in front of needle valve seems to leek - needle valve must be closed on each use.
 +
 +==== Day 2026-03-30 ====
 +Brought the two coating systems and the control cabinet into our lab.
 +