meta data for this page
Differences
This shows you the differences between two versions of the page.
| Both sides previous revisionPrevious revisionNext revision | Previous revision | ||
| equipment:edwards-306:start [2026/04/30 18:32] – [Principles of operation] q3k | equipment:edwards-306:start [2026/07/18 22:09] (current) – q3k | ||
|---|---|---|---|
| Line 1: | Line 1: | ||
| ====== Edwards AUTO 306 Coating System ====== | ====== Edwards AUTO 306 Coating System ====== | ||
| - | {{: | + | {{: |
| Multi-process PVD system consisting of two Edwards AUTO 306 coaters and a control cabinet. | Multi-process PVD system consisting of two Edwards AUTO 306 coaters and a control cabinet. | ||
| Line 10: | Line 10: | ||
| **Sputter: | **Sputter: | ||
| - | Needs Argon and refurbishing / bringup. | + | First sputter experiments were successful, process being tuned and MFC contro system is being built |
| **Coater:** | **Coater:** | ||
| - | Thermal evaporation works, e-beam needs bringup. Film thickness monitor needs a new crystal. | + | Working. |
| ===== Resources ===== | ===== Resources ===== | ||
| * [[equipment: | * [[equipment: | ||
| - | * [[https:// | + | |
| - | * [[https:// | + | |
| - | * [[https:// | + | * [[https:// |
| - | * Techtree: [[https:// | + | * [[https:// |
| + | * Techtree: | ||
| + | * [[https:// | ||
| + | * [[https:// | ||
| + | * [[https:// | ||
| - | {{: | ||
| ===== Standard Operating Procedure ===== | ===== Standard Operating Procedure ===== | ||
| + | {{: | ||
| Currently written for the thermal evap unit, should be unified with the sputter unit as it is brought up. | Currently written for the thermal evap unit, should be unified with the sputter unit as it is brought up. | ||
| Line 50: | Line 54: | ||
| * **Reset**: in case of failure (timeout, power failure, etc.), acknowledge the fault | * **Reset**: in case of failure (timeout, power failure, etc.), acknowledge the fault | ||
| * **Cycle**: Perform the process above reaching an ultra high vacuum | * **Cycle**: Perform the process above reaching an ultra high vacuum | ||
| - | * **Process**: | + | * **Process**: |
| * **Seal**: Isolate the chamber from the rest of the system. Usually a prerequisite to then stop or vent the system. | * **Seal**: Isolate the chamber from the rest of the system. Usually a prerequisite to then stop or vent the system. | ||
| * **Stop**: Perform a shutdown process: spin down the turbo and turn off the roughing pump. | * **Stop**: Perform a shutdown process: spin down the turbo and turn off the roughing pump. | ||
| Line 83: | Line 87: | ||
| - Insert sample, and check that shutter actuates when ' | - Insert sample, and check that shutter actuates when ' | ||
| - Press ' | - Press ' | ||
| + | |||
| + | ==== Plasma Cleaning ==== | ||
| + | |||
| + | - Load sample | ||
| + | - Press ' | ||
| + | - Wait until 'fine pumping' | ||
| + | - Press ' | ||
| + | - Select the ' | ||
| + | - Open the vent butterfly valve (below chamber), and then slowly open needle valve until pressure starts rising. | ||
| + | - Close valves when pressure reaches around 1e-1 mbar. If overshot, restart process. | ||
| + | - Set LT/0/HT selector to HT, slowly bring up power knob until plasma starts in the chamber and current flows. | ||
| + | - Tweak needle valve and power until a stable plasma is achieved that fills up as much of the chamber as possible. | ||
| + | - Manual recommends running plasma cleaning for 20 minutes for every loaded sample before coating it. No experiments have been performed to confirm whether this actually helps with coating. | ||
| ==== Simple Coating ==== | ==== Simple Coating ==== | ||
| Line 109: | Line 126: | ||
| - Turn off power at rack unit. | - Turn off power at rack unit. | ||
| + | ===== Sputter coater MFCs ===== | ||
| + | |||
| + | Channel 1: 100SCCM Ar. Channel 2: 100SCCM N2. | ||
| + | |||
| + | Pinout: | ||
| + | |||
| + | * Pin 2: Control 0-10V (0-100% of rated flow). | ||
| + | * Pin 4: Output 0-10V (feedback from control). | ||
| + | * Pin 5: shield | ||
| + | * Pin 6: +15V | ||
| + | * Pin 7: test output (unknown) | ||
| + | * Pin 8: common/GND | ||
| + | * Pin 9: -15V | ||
| + | Currently controlled by lab PSUs. Modbus integration is WIP. | ||