Semiconductor Equipment Corp Die Bonder 1350

Ultrasonic WireBonder with UTI 5c was Bonding Controller

Model: 1350 according to documents

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1. Found out, that we actually need to supply a vacuum to the vacuum chuck. the membrane pump we took from Wedel (MW 63/4) is usable for the vacuum chuck. As it is kinda old, we should probably think about getting a “newer” one.
2. Tested the UTI+the “Arm” –> All functionality seemed to work in a correct fashion.
3. TODO: We have to find out, whether the needle has any hole, where we can thread the wire into.
4. TODO:We have to find out, if we need some form of knife to cut the wire during bonding process.
5. TODO: We assume, that we have to align the microscope optics better. See following video by Zam Zeloof( Wire Bonding Basics - Manual Wedge Bonding ICs , where pictures of a similar optics to ours are shown.

After thorough cleaning plugged in the system into a power socket. This works. The UTI 5c shown that it got supplied with power. When pressing the pedal, the green light of channel 1 and channel 2 lit up in an alternating fashion